ECE is specialized in developing tooling technology and skilled in precision stamping dies and stamping parts. Our stamping products include lead frame for semiconductor and opto-electronics/LED/SMD components, Heat spreader for semiconductor, terminals for electronic components/connectors, high precision stamping parts, insert molding parts, and high precision stamping dies.

ECE’s solderless/crimp connectors are best suitable for portable devices (MP3, PDA, mobile phone, DSC, GPS, etc.), I/A, notebook, computer and peripherals, etc. solderless/crimp connectors (also called board to wire connectors) have different pitches at 1.0mm & 1.25mm with different connector heights. Number of contacts is also available from 2~30 pins.